SLLSFC3A March 2020 – December 2021 ISO1640-Q1
PRODUCTION DATA
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Power Ratings
- Insulation Specifications
- 6.6 Safety-Related Certifications
- 6.7 Safety Limiting Values
- 6.8 Electrical Characteristics
- 6.9 Supply Current Characteristics
- 6.10 Timing Requirements
- 6.11 Switching Characteristics
- 6.12 Insulation Characteristics Curves
- 6.13 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DW|16
訂購信息
6.13 Typical Characteristics
| TA = 25°C |
| VCC1 = 3.3 V |
| VCC2 = 3.3 V | C2 = 400 pF |
| C1 = 80 pF | C2 = 400 pF |
Figure 6-13 tPLH1-2 Propagation Delay vs Free-Air
Temperature
Figure 6-15 tPHL1-2 Propagation Delay vs Free-Air
Temperature
Figure 6-17 tPLH2-1 Propagation Delay vs Free-Air
Temperature
Figure 6-19 tPHL2-1 Propagation Delay vs Free-Air
Temperature
Figure 6-21 ISO1642: ICC vs
GPIO Speed at 3.3V
Figure 6-23 ISO1643: ICC vs
GPIO Speed at 3.3V
Figure 6-25 ISO1644: ICC vs
GPIO Speed at 3.3V
| VCC1 = 5 V |
| VCC2 = 5 V | C2 = 400 pF |
| VCC2 = 2.5 V | C2 = 400 pF |
| C1 = 80 pF | C2 = 400 pF |
Figure 6-14 tPLH1-2 Propagation Delay vs Free-Air
Temperature
Figure 6-16 tPHL1-2 Propagation Delay vs Free-Air
Temperature
Figure 6-18 tPLH2-1 Propagation Delay vs Free-Air
Temperature
Figure 6-20 tPHL2-1 Propagation Delay vs Free-Air
Temperature
Figure 6-22 ISO1642: ICC vs
GPIO Speed at 5V
Figure 6-24 ISO1643: ICC vs
GPIO Speed at 5V
Figure 6-26 ISO1644: ICC vs
GPIO Speed at 5V