ZHCSSZ5F march 2008 – august 2023 ISO1176
PRODUCTION DATA
| THERMAL METRIC(1) | ISO1176 | UNIT | |
|---|---|---|---|
| DW (SOIC) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 81.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 41.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 46.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 15.0 | °C/W |
| ψJB | Junction-to-board characterization parameter | 45.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |