ZHCSRZ2A april 2023 – june 2023 ESD451
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC (1) | ESD451 | UNIT | |
|---|---|---|---|
| DPL (X2SON) | |||
| 2 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 356.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 201.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 136.4 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 2.6 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 135.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | NA | °C/W |