ZHCS927G May 2012 – January 2018 CDCM6208
PRODUCTION DATA.
| THERMAL METRIC(1) | CDCM6208 | UNIT | |
|---|---|---|---|
| RGZ (VQFN) | |||
| 48 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 30.27 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 16.58 | °C/W |
| RθJB | Junction-to-board thermal resistance | 6.83 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.23 | °C/W |
| ψJB | Junction-to-board characterization parameter | 6.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.06 | °C/W |