ZHCSPR5J March 1998 – October 2022 CD54HC112 , CD54HCT112 , CD74HC112 , CD74HCT112
PRODMIX
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC | D (SOIC) | N (PDIP) | NS (SO) | PW (TSSOP) | UNIT | |
|---|---|---|---|---|---|---|
| 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(1) | 117.2 | 69.3 | 88.4 | 137.5 | °C/W |
| RθJC (top) | Junction-to-case (top) thermal resistance | 77.2 | 61.8 | 46 | 75.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 75.6 | 49.3 | 50.6 | 82.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 38.1 | 34.6 | 13 | 25.1 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 75.3 | 49 | 50.2 | 81.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | °C/W |