ZHCSJL6D August 1998 – March 2025 CD4051B-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | CD4051B-Q1 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | PW (TSSOP) | |||
| 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 86.7 | 116.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 47.3 | 47.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 45.3 | 63.0 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 12.1 | 6.4 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 44.9 | 62.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |