ZHCSHU6L march 2018 – august 2023 BQ77915
PRODUCTION DATA
| THERMAL METRIC | BQ77915 PW (TSSOP) 24 PINS | UNIT(1) | |
|---|---|---|---|
| RΘJA | Junction-to-ambient thermal resistance | 88.9 | °C/W |
| RΘJC(top) | Junction-to-case thermal resistance | 26.5 | °C/W |
| RΘJB | Junction-to-board thermal resistance | 43.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 43 | °C/W |