ZHCSDZ3D December 2014 – January 2017
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 說(shuō)明 （續(xù)）
- 6 Pin Configuration and Functions
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7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Supply Voltage
- 7.6 Supply Current
- 7.7 Power Supply Control
- 7.8 Low-Voltage General Purpose I/O (TSx)
- 7.9 High-Voltage General Purpose I/O (GPIO0, GPIO1)
- 7.10 AFE Power-On Reset
- 7.11 Internal 1.8-V LDO
- 7.12 Current Wake Comparator
- 7.13 Coulomb Counter
- 7.14 CC Digital Filter
- 7.15 ADC
- 7.16 ADC Digital Filter
- 7.17 ADC Multiplexer
- 7.18 Cell Balancing Support
- 7.19 Cell Detach Detection
- 7.20 Internal Temperature Sensor
- 7.21 NTC Thermistor Measurement Support (ADCx)
- 7.22 High-Frequency Oscillator
- 7.23 Low-Frequency Oscillator
- 7.24 Voltage Reference 1
- 7.25 Voltage Reference 2
- 7.26 Instruction Flash
- 7.27 Data Flash
- 7.28 Current Protection Thresholds
- 7.29 N-CH FET Drive (CHG, DSG)
- 7.30 FUSE Drive (AFEFUSE)
- 7.31 Battery Charger Voltage Regulation (VFB)
- 7.32 Battery Charger Current Sense (HSRP, HSRN)
- 7.33 Battery Charger Precharge Current Sense (HSRP, HSRN)
- 7.34 AC Adapter Fault Detect (HSRN, VCC)
- 7.35 Battery Charger Overcurrent Detection (V)HSRP, (V)HSRN
- 7.36 Battery Charger Undercurrent Detection (V)HSRP, (V)HSRN
- 7.37 System Operation Detection (V)HSRN
- 7.38 Battery Overvoltage Comparator (VFB)
- 7.39 Regulator (REGN)
- 7.40 PWM High-Side Driver (HiDRV)
- 7.41 PWM Low-Side Driver (LoDRV)
- 7.42 PWM Information
- 7.43 Charger Power-Up Sequence
- 7.44 Thermal Shutdown Comparator
- 7.45 SMBus High Voltage I/O
- 7.46 SMBus
- 7.47 SMBus XL
- 7.48 Timing Requirements
- 7.49 Typical Characteristics
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3 Feature Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RHB|32
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RHB|32
訂購(gòu)信息
12 器件和文檔支持
12.1 相關(guān)文檔
如需相關(guān)文檔，請(qǐng)參閱《bq40z60 技術(shù)參考手冊(cè)》（文獻(xiàn)編號(hào)：SLUUA04）。
12.2 社區(qū)資源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
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TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
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Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.3 商標(biāo)
Impedance Track, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 靜電放電警告
ESD 可能會(huì)損壞該集成電路。德州儀器 (TI) 建議通過(guò)適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理措施和安裝程序 , 可能會(huì)損壞集成電路。
ESD 的損壞小至導(dǎo)致微小的性能降級(jí) , 大至整個(gè)器件故障。 精密的集成電路可能更容易受到損壞 , 這是因?yàn)榉浅＜?xì)微的參數(shù)更改都可能會(huì)導(dǎo)致器件與其發(fā)布的規(guī)格不相符。
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.