ZHCSI54A September 2016 – May 2018 BQ25890H
PRODUCTION DATA.
| THERMAL METRIC(1) | BQ25890H | UNIT | |
|---|---|---|---|
| RTW (WQFN) | |||
| 24-PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 31.8 | °C/W |
| RθJC((op) | Junction-to-case (top) thermal resistance | 27.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 8.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 8.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.0 | °C/W |