SLUSG28 August 2025 BQ25176K
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DSG|8
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DSG|8
訂購信息
4 Pin Configuration and Functions
Figure 4-1 DSG Package8-Pin
WSONTop ViewTable 4-1 Pin Functions
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NUMBER | ||
| IN | 1 | P | Input power, connected to external DC supply. Bypass IN with at least 1μF capacitor to GND, placed close to the IC. |
| ISET | 2 | I | Programs the device fast-charge current. External resistor from ISET to GND defines fast charge current value. Expected range is 30k? (10mA) to 375? (800mA). ICHG = KISET / RISET. Precharge current is defined as 20% of ICHG. Termination current is defined as 10% of ICHG. |
|
TS |
3 |
I |
Temperature qualification voltage input. Connect a negative temperature coefficient (NTC) thermistor directly from TS to GND (AT103-2 recommended). Charge suspends when the TS pin voltage is out of range. If TS function is not needed, connect an external 10kΩ resistor from this pin to GND. Pulling TS < VTS_ENZ will disable the charger. |
| GND | 4 | – | Ground pin |
| STAT | 5 | O | Open drain charger status indication output. Connect to pull-up
rail via 10kΩ resistor. LOW indicates charge in progress. HIGH indicates charge complete or charge disabled. When a fault condition is detected STAT pin blinks at 1Hz. |
| PG | 6 | O | Open drain charge power good indication output. Connect to pull-up
rail via 10kΩ resistor. PG pulls low when VIN > VIN_LOWV and VOUT + VSLEEPZ < VIN < VIN_OV. |
| VSET | 7 | I | Programs the regulation voltage for OUT pin with a pull-down resistor. Valid resistor range is 18.2kΩ to 100kΩ, values outside this range will suspend charge. Refer to Section 6.3.1.2 for voltage level details. Recommend using ±1% tolerance resistor with <200ppm/oC temperature coefficient. |
| OUT | 8 | P | Battery connection. System Load may be connected in parallel to battery. Bypass OUT with at least 1μF capacitor to GND, placed close to the IC. |
| Thermal Pad | — | — | Exposed pad beneath the IC for heat dissipation. Solder thermal pad to the board with vias connecting to solid GND plane. |