ZHCSL85B May 2020 – April 2021 AMC3306M25
PRODUCTION DATA
| THERMAL METRIC(1) |
AMC3306M25
|
UNIT | |
|---|---|---|---|
| DWE (SOIC) | |||
| 16 PINS | |||
| Rθ JA | Junction-to-ambient thermal resistance | 73.5 | °C/W |
| Rθ JC(top) | Junction-to-case (top) thermal resistance | 31 | °C/W |
| Rθ JB | Junction-to-board thermal resistance | 44 | °C/W |
| ψJT | Junction-to-top characterization parameter | 16.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 42.8 | °C/W |
| Rθ JC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |