ZHCSG26C March 2017 – Janaury 2020 AMC1306E05 , AMC1306E25 , AMC1306M05 , AMC1306M25
PRODUCTION DATA.
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC (1) | AMC1306x | UNIT | |
|---|---|---|---|
| DWV (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 112.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 47.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 60.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 23.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 60.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |