ZHCSEU3E July 2014 – June 2022 ADC3221 , ADC3222 , ADC3223 , ADC3224
PRODUCTION DATA
| THERMAL METRIC(1) | ADC322x | UNIT | |
|---|---|---|---|
| RGZ (VQFN) | |||
| 48 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 25.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 18.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 3.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.5 | °C/W |