ZHCSUL6 February 2024 ADC12DL1500 , ADC12DL2500 , ADC12DL500
PRODUCTION DATA
| THERMAL METRIC(1) | ACF (FCBGA) | UNIT | |
|---|---|---|---|
| 256 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 16.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 0.94 | °C/W |
| RθJB | Junction-to-board thermal resistance | 5.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 5.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |