选择版本

选择版本

未找到结果。请清除搜索并重试。

SIMPLELINK-LOWPOWER-F3-SDK

SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

选择版本
未找到结果。请清除搜索并重试。
最新版本
版本: 9.14.00.39
发布日期: 2025-11-11
产品
低功耗 2.4GHz 产品
CC2340R2 具有 256kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 2.4GHz 无线 MCU CC2340R5 具有 512kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 2.4GHz 无线 MCU CC2755R10 具有 1MB 闪存、HSM、APU 的 SimpleLink™ 32 位 Arm® Cortex®-M33 多协议无线 MCU
汽车类无线连接产品
CC2340R5-Q1 具有 512kB 闪存、符合汽车标准的 SimpleLink™ 低功耗 Bluetooth® 无线 MCU CC2744R7-Q1 具有 864kB 闪存、HSM 和 APU 的汽车级 SimpleLink™ 低功耗 Bluetooth® 无线 MCU CC2745P10-Q1 具有 1MB 闪存、HSM、APU、CAN-FD 和 +20dBm 的汽车级 SimpleLink™ 低功耗 Bluetooth® 无线 MCU CC2745R10-Q1 具有 1MB 闪存、HSM、APU 和 CAN-FD 的汽车级 SimpleLink™ 低功耗 Bluetooth® 无线 MCU CC2745R7-Q1 具有 864kB 闪存、HSM、APU 和 CAN-FD 的汽车级 SimpleLink™ 低功耗 Bluetooth® 无线 MCU
硬件开发
评估板
LP-EM-CC2340R5 CC2340R5 SimpleLink™ 低功耗 Bluetooth® 5.3 MCU LaunchPad™ 开发套件 LP-EM-CC2340R53 适用于 CC2340R SimpleLink™ 系列 2.4GHz 多标准无线 MCU 的 LaunchPad™ 开发套件 LP-EM-CC2745R10-Q1 CC2745R10-Q1 SimpleLink™ 2.4GHz 无线 MCU LaunchPad™ 开发套件

发布信息

The SimpleLink™ Low Power F3 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC23xx and CC27xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC23xx and CC27xx wireless MCU users by packaging essential software components, such as:

  • Bluetooth® Low Energy (Bluetooth LE) protocol stack
  • Zigbee® protocol stack supporting low power wireless mesh networks
  • Proprietary RF layer
  • TI Drivers

All of the above are provided in one easy-to-use software package along with example applications and documentation.

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit TI SimpleLink Wireless Connectivity.

This is version 9.14.00.39 of the SimpleLink Low Power F3 SDK.

新增功能

  • New HSM Firmware Version 3.1.1