SN75LVDS83B
- LVDS Display Series Interfaces Directly to LCD
Display Panels With Integrated LVDS - Package Options: 4.5-mm × 7-mm BGA,
and 8.1-mm × 14-mm TSSOP - 1.8-V Up to 3.3-V Tolerant Data Inputs to Connect
Directly to Low-Power, Low-Voltage Application and
Graphic Processors - Transfer Rate up to 135 Mpps (Mega Pixel Per Second);
Pixel Clock Frequency Range 10 MHz to 135 MHz - Suited for Display Resolutions Ranging From HVGA
up to HD With Low EMI - Operates From a Single 3.3-V Supply and 170 mW (Typ.)
at 75 MHz - 28 Data Channels Plus Clock in Low-Voltage TTL to 4
Data Channels Plus Clock Out Low-Voltage Differential - Consumes Less Than 1 mW When Disabled
- Selectable Rising or Falling Clock Edge Triggered
Inputs - ESD: 5-kV HBM
- Support Spread Spectrum Clocking (SSC)
- Compatible with all OMAP? 2x, OMAP? 3x, and
DaVinci? Application Processors
The SN75LVDS83B FlatLink™ transmitter contains four 7-bit parallel-load serial-out shift registers, a 7X clock synthesizer, and five Low-Voltage Differential Signaling (LVDS) line drivers in a single integrated circuit. These functions allow 28 bits of single-ended LVTTL data to be synchronously transmitted over five balanced-pair conductors for receipt by a compatible receiver, such as the SN75LVDS82 and LCD panels with integrated LVDS receiver.
When transmitting, data bits D0 through D27 are each loaded into registers upon the edge of the input clock signal (CLKIN). The rising or falling edge of the clock can be selected via the clock select (CLKSEL) pin. The frequency of CLKIN is multiplied seven times, and then used to unload the data registers in 7-bit slices and serially. The four serial streams and a phase-locked clock (CLKOUT) are then output to LVDS output drivers. The frequency of CLKOUT is the same as the input clock, CLKIN.
The SN75LVDS83B requires no external components and little or no control. The data bus appears the same at the input to the transmitter and output of the receiver with the data transmission transparent to the user(s). The only user intervention is selecting a clock rising edge by inputting a high level to CLKSEL or a falling edge with a low-level input, and the possible use of the Shutdown/Clear (SHTDN). SHTDN is an active-low input to inhibit the clock, and shut off the LVDS output drivers for lower power consumption. A low-level on this signal clears all internal registers to a low-level.
The SN75LVDS83B is characterized for operation over ambient air temperatures of 10°C to 70°C.
Alternative device option: The SN75LVDS83A (SLLS980) is an alternative to the SN75LVDS83B for clock frequency range of 10MHz-100MHz only. The SN75LVDS83A is available in the TSSOP package option only.
技術(shù)文檔
| 類型 | 標題 | 下載最新的英語版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | SN75LVDS83B FlatLink? Transmitter 數(shù)據(jù)表 (Rev. C) | PDF | HTML | 2014年 7月 29日 | ||
| 應(yīng)用手冊 | AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines (Rev. A) | 2018年 8月 3日 | ||||
| 應(yīng)用手冊 | How to Bridge HDMI/DVI to LVDS/OLDI (Rev. C) | 2018年 6月 7日 | ||||
| 技術(shù)文章 | Applications of Low Voltage Differential Signaling (LVDS) in Multifunction and Ind | PDF | HTML | 2017年 8月 24日 | |||
| 應(yīng)用手冊 | FlatLink? Data Transmission System Using SN75LVDS83B/SN75LVDS82/SN75LVDS86A | 2010年 2月 2日 |
設(shè)計和開發(fā)
如需其他信息或資源,請點擊以下任一標題進入詳情頁面查看(如有)。
LVDS83BTSSOPEVM — LVDS83BT 10 -135MHz 28位 LVDS 發(fā)送器/串行器評估模塊
PSPICE-FOR-TI — PSpice? for TI 設(shè)計和仿真工具
借助?PSpice for TI 的設(shè)計和仿真環(huán)境及其內(nèi)置的模型庫,您可對復(fù)雜的混合信號設(shè)計進行仿真。創(chuàng)建完整的終端設(shè)備設(shè)計和原型解決方案,然后再進行布局和制造,可縮短產(chǎn)品上市時間并降低開發(fā)成本。?
在?PSpice for TI 設(shè)計和仿真工具中,您可以搜索 TI (...)
TINA-TI — 基于 SPICE 的模擬仿真程序
TINA-TI 安裝需要大約 500MB。直接安裝,如果想卸載也很容易。我們相信您肯定會愛不釋手。
TINA 是德州儀器 (TI) 專有的 DesignSoft 產(chǎn)品。該免費版本具有完整的功能,但不支持完整版 TINA 所提供的某些其他功能。
如需獲取可用 TINA-TI 模型的完整列表,請參閱:SpiceRack - 完整列表
需要 HSpice (...)
TIDA-010013 — 適用于 Sitara? 處理器的 RGB 到 OLDI/LVDS 顯示橋參考設(shè)計
| 封裝 | 引腳 | CAD 符號、封裝和 3D 模型 |
|---|---|---|
| TSSOP (DGG) | 56 | Ultra Librarian |
訂購和質(zhì)量
- RoHS
- REACH
- 器件標識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測
- 制造廠地點
- 封裝廠地點
推薦產(chǎn)品可能包含與 TI 此產(chǎn)品相關(guān)的參數(shù)、評估模塊或參考設(shè)計。