SN75LVDS387
- Four (’391), Eight (’389), or Sixteen (’387) Line
Drivers Meet or Exceed the Requirements of ANSI
EIA/TIA-644 Standard - Designed for Signaling Rates Up to 630?Mbps
With Very Low Radiation (EMI) - Low-Voltage Differential Signaling With Typical
Output Voltage of 350 mV and a 100-Ω Load - Propagation Delay Times Less Than 2.9 ns
- Output Skew Is Less Than 150 ps
- Part-to-Part Skew Is Less Than 1.5 ns
- 35-mW Total Power Dissipation in Each Driver
Operating at 200 MHz - Driver Is High-Impedance When Disabled or With
VCC < 1.5 V - SN65’ Version Bus-Pin ESD Protection Exceeds
15 kV - Packaged in Thin Shrink Small-Outline Package
With 20-mil Pin Pitch - Low-Voltage TTL (LVTTL) Logic Inputs Are 5-V
Tolerant
This family of 4, 8, and 16 differential line drivers implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the 16 current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100-Ω load when enabled.
When disabled, the driver outputs are high-impedance. Each driver input (A) and enable (EN) have an internal pulldown that will drive the input to a low level when open-circuited.
The SN65LVDS387, SN65LVDS389, and SN65LVDS391 devices are characterized for operation from –40°C to 85°C. The SN75LVDS387, SN75LVDS389, and SN75LVDS391 devices are characterized for operation from 0°C to 70°C.
技術(shù)文檔
| 類型 | 標(biāo)題 | 下載最新的英語(yǔ)版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | SNx5LVDS3xx High-Speed Differential Line Drivers 數(shù)據(jù)表 (Rev. G) | PDF | HTML | 2016年 1月 14日 | ||
| 應(yīng)用簡(jiǎn)報(bào) | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||||
| 應(yīng)用簡(jiǎn)報(bào) | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||||
| 應(yīng)用簡(jiǎn)報(bào) | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||||
| 應(yīng)用手冊(cè) | An Overview of LVDS Technology | 1998年 10月 5日 |
設(shè)計(jì)和開(kāi)發(fā)
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SN65LVDS387EVM — 16 通道 LVDS 驅(qū)動(dòng)器評(píng)估模塊
We have designed easy-to-use evaluation modules (EVM) for our 16-channel low-voltage differential signaling (LVDS) driver and receivers. Flexibility has been designed into these EVMs so they can be set up in a point-to-point topology (1 driver to 1 receiver) or a multidrop topology (1 driver (...)
PSPICE-FOR-TI — PSpice? for TI 設(shè)計(jì)和仿真工具
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TINA-TI — 基于 SPICE 的模擬仿真程序
TINA-TI 安裝需要大約 500MB。直接安裝，如果想卸載也很容易。我們相信您肯定會(huì)愛(ài)不釋手。
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需要 HSpice (...)
| 封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
|---|---|---|
| TSSOP (DGG) | 64 | Ultra Librarian |
訂購(gòu)和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測(cè)
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)