SN75LVDS32
- Meets or Exceeds the Requirements of ANSI TIA/EIA-644 Standard
- Operates With a Single 3.3-V Supply
- Designed for Signaling Rate of up to 155 Mbps
- Differential Input Thresholds ±100 mV Max
- Low-Voltage TTL (LVTTL) Logic Output Levels
- Open-Circuit Fail Safe
- Characterized For Operation From 0&dg;C to 70°C
The SN75LVDS32 and SN75LVDS9637 are differential line receivers that implement the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the four differential receivers provides a valid logical output state with a ±100 mV allow operation with a differential input voltage within the input common-mode voltage range. The input common-mode voltage range allows 1 V of ground potential difference between two LVDS nodes.
The intended application of these devices and signaling technique is both point-to-point and multidrop (one
driver and multiple receivers) data transmission over controlled impedance media of approximately 100
. The
transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance
of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the
environment.
The SN75LVDS32 and SN75LVDS9637 are characterized for operation from 0°C to 70°C.
技術(shù)文檔
| 類型 | 標(biāo)題 | 下載最新的英語版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | High-Speed Differential Line Receivers 數(shù)據(jù)表 (Rev. B) | 2001年 6月 22日 | |||
| 應(yīng)用簡報(bào) | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||||
| 應(yīng)用簡報(bào) | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||||
| 應(yīng)用簡報(bào) | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||||
| 應(yīng)用手冊 | An Overview of LVDS Technology | 1998年 10月 5日 |
設(shè)計(jì)和開發(fā)
如需其他信息或資源,請點(diǎn)擊以下任一標(biāo)題進(jìn)入詳情頁面查看(如有)。
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| 封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
|---|---|---|
| SOIC (D) | 16 | Ultra Librarian |
訂購和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)