SN74ALS573C

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具有三態(tài)輸出的八通道 D 類透明鎖存器

產(chǎn)品詳情

Number of channels 8 Technology family ALS Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type Bipolar Output type 3-State Clock frequency (max) (MHz) 75 IOL (max) (mA) 24 IOH (max) (mA) -2.6 Supply current (max) (μA) 27000 Features Flow-through pinout, High speed (tpd 10-50ns) Operating temperature range (°C) 0 to 70 Rating Catalog
Number of channels 8 Technology family ALS Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type Bipolar Output type 3-State Clock frequency (max) (MHz) 75 IOL (max) (mA) 24 IOH (max) (mA) -2.6 Supply current (max) (μA) 27000 Features Flow-through pinout, High speed (tpd 10-50ns) Operating temperature range (°C) 0 to 70 Rating Catalog
PDIP (N) 20 228.702 mm2 24.33 x 9.4 SOIC (DW) 20 131.84 mm2 12.8 x 10.3 SOP (NS) 20 98.28 mm2 12.6 x 7.8 SSOP (DB) 20 56.16 mm2 7.2 x 7.8
  • 3-State Buffer-Type Outputs Drive Bus Lines Directly
  • Bus-Structured Pinout
  • True Logic Outputs
  • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages

 

  • 3-State Buffer-Type Outputs Drive Bus Lines Directly
  • Bus-Structured Pinout
  • True Logic Outputs
  • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages

 

These octal D-type transparent latches feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

While the latch-enable (LE) input is high, outputs (Q) respond to the data (D) inputs. When LE is low, the outputs are latched to retain the data that was set up.

A buffered output-enable () input can be used to place the eight outputs in either a normal logic state (high or low) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without interface or pullup components.

does not affect internal operation of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN54ALS573C and SN54AS573A are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALS573C and SN74AS573A are characterized for operation from 0°C to 70°C.

 

 

These octal D-type transparent latches feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

While the latch-enable (LE) input is high, outputs (Q) respond to the data (D) inputs. When LE is low, the outputs are latched to retain the data that was set up.

A buffered output-enable () input can be used to place the eight outputs in either a normal logic state (high or low) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without interface or pullup components.

does not affect internal operation of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN54ALS573C and SN54AS573A are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALS573C and SN74AS573A are characterized for operation from 0°C to 70°C.

 

 

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類型 標(biāo)題 下載最新的英語(yǔ)版本 日期
* 數(shù)據(jù)表 Octal D-Type Transparent Latches With 3-State Outputs 數(shù)據(jù)表 (Rev. D) 1995年 1月 1日

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包含信息:
  • RoHS
  • REACH
  • 器件標(biāo)識(shí)
  • 引腳鍍層/焊球材料
  • MSL 等級(jí)/回流焊峰值溫度
  • MTBF/時(shí)基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測(cè)
包含信息:
  • 制造廠地點(diǎn)
  • 封裝廠地點(diǎn)

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