SN74AHCT16374

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具有三態(tài)輸出的 16 位邊沿 D 類觸發(fā)器

產(chǎn)品詳情

Number of channels 16 Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 70 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (μA) 40 Features Balanced outputs, Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 16 Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 70 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (μA) 40 Features Balanced outputs, Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
SSOP (DL) 48 164.358 mm2 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm2 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm2 9.7 x 6.4
  • Members of the Texas Instruments WidebusTM Family
  • EPICTM (Enhanced-Performance Implanted CMOS) Process
  • Inputs Are TTL-Voltage Compatible
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

EPIC and Widebus are trademarks of Texas Instruments Incorporated.
  • Members of the Texas Instruments WidebusTM Family
  • EPICTM (Enhanced-Performance Implanted CMOS) Process
  • Inputs Are TTL-Voltage Compatible
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The 'AHCT16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.

A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN54AHCT16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHCT16374 is characterized for operation from -40°C to 85°C.

The 'AHCT16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.

A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN54AHCT16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHCT16374 is characterized for operation from -40°C to 85°C.

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類型 標(biāo)題 下載最新的英語(yǔ)版本 日期
* 數(shù)據(jù)表 SNX4AHCT1637416-Bit Edge-Triggered D-Type Flip-Flops With 3-State Outputs 數(shù)據(jù)表 (Rev. I) 2000年 2月 21日
應(yīng)用手冊(cè) 慢速或浮點(diǎn) CMOS 輸入的影響 (Rev. E) PDF | HTML 英語(yǔ)版 (Rev.E) 2025年 3月 26日
應(yīng)用手冊(cè) Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
選擇指南 Little Logic Guide 2018 (Rev. G) 2018年 7月 6日
選擇指南 Logic Guide (Rev. AB) 2017年 6月 12日
應(yīng)用手冊(cè) How to Select Little Logic (Rev. A) 2016年 7月 26日
應(yīng)用手冊(cè) Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
選擇指南 邏輯器件指南 2014 (Rev. AA) 最新英語(yǔ)版本 (Rev.AC) PDF | HTML 2014年 11月 17日
選擇指南 小尺寸邏輯器件指南 (Rev. E) 最新英語(yǔ)版本 (Rev.G) 2012年 7月 16日
用戶指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
應(yīng)用手冊(cè) 選擇正確的電平轉(zhuǎn)換解決方案 (Rev. A) 英語(yǔ)版 (Rev.A) 2006年 3月 23日
產(chǎn)品概述 Design Summary for WCSP Little Logic (Rev. B) 2004年 11月 4日
應(yīng)用手冊(cè) Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
應(yīng)用手冊(cè) Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 2002年 12月 2日
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設(shè)計(jì)指南 AHC/AHCT Designer's Guide February 2000 (Rev. D) 2000年 2月 24日
產(chǎn)品概述 Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 1998年 4月 1日
應(yīng)用手冊(cè) Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997年 12月 1日
應(yīng)用手冊(cè) Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
應(yīng)用手冊(cè) CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
應(yīng)用手冊(cè) Live Insertion 1996年 10月 1日
選擇指南 Logic Guide (Rev. AC) PDF | HTML 1994年 6月 1日

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SSOP (DL) 48 Ultra Librarian
TSSOP (DGG) 48 Ultra Librarian
TVSOP (DGV) 48 Ultra Librarian

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  • 引腳鍍層/焊球材料
  • MSL 等級(jí)/回流焊峰值溫度
  • MTBF/時(shí)基故障估算
  • 材料成分
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