SN74ABT374A

正在供貨

具有三態(tài)輸出的八路邊沿 D 類觸發(fā)器

產(chǎn)品詳情

Number of channels 8 Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 150 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (μA) 30000 Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 8 Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 150 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (μA) 30000 Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
PDIP (N) 20 228.702 mm2 24.33 x 9.4 SOIC (DW) 20 131.84 mm2 12.8 x 10.3 SOP (NS) 20 98.28 mm2 12.6 x 7.8 SSOP (DB) 20 56.16 mm2 7.2 x 7.8 TSSOP (PW) 20 41.6 mm2 6.5 x 6.4
  • State-of-the-Art EPIC-IIBTM BiCMOS Design Significantly Reduces Power Dissipation
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

 

EPIC-IIB is a trademark of Texas Instruments Incorporated.
  • State-of-the-Art EPIC-IIBTM BiCMOS Design Significantly Reduces Power Dissipation
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

 

EPIC-IIB is a trademark of Texas Instruments Incorporated.

These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The eight flip-flops of the SN54ABT374 and SN74ABT374A are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.

A buffered output-enable () input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT374A is characterized for operation from -40°C to 85°C.

 

 

These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The eight flip-flops of the SN54ABT374 and SN74ABT374A are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.

A buffered output-enable () input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT374A is characterized for operation from -40°C to 85°C.

 

 
下載 觀看帶字幕的視頻 視頻

您可能感興趣的相似產(chǎn)品

功能優(yōu)于所比較器件的普遍直接替代產(chǎn)品
SN74AHCT374 正在供貨 具有三態(tài)輸出的八路邊沿觸發(fā)式 D 型觸發(fā)器 Larger voltage range (2V to 5.5V)
功能與比較器件相同，且具有相同引腳
SN74LVC374A 正在供貨 具有三態(tài)輸出的八通道邊沿觸發(fā)式 D 型觸發(fā)器 Lower average drive strength (24mA), longer average propagation delay (5.5ns)
功能與比較器件相同，但引腳排列有所不同
CD74ACT374 正在供貨 具有三態(tài)輸出的八路 D 類觸發(fā)器 Longer propagation delay (8ns), lower average drive strength (24mA)
SN74ACT374 正在供貨 具有三態(tài)輸出的八路 D 類邊沿觸發(fā)器 Longer propagation delay (8ns), lower average drive strength (24mA)

技術文檔

star =有關此產(chǎn)品的 TI 精選熱門文檔
未找到結(jié)果。請清除搜索并重試。
查看全部 22
類型 標題 下載最新的英語版本 日期
* 數(shù)據(jù)表 Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 數(shù)據(jù)表 (Rev. G) 1997年 1月 1日
應用手冊 慢速或浮點 CMOS 輸入的影響 (Rev. E) PDF | HTML 英語版 (Rev.E) 2025年 3月 26日
應用手冊 Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
選擇指南 Logic Guide (Rev. AB) 2017年 6月 12日
應用手冊 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
選擇指南 邏輯器件指南 2014 (Rev. AA) 最新英語版本 (Rev.AC) PDF | HTML 2014年 11月 17日
選擇指南 《高級總線接口邏輯器件選擇指南》 英語版 2010年 7月 7日
用戶指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
應用手冊 選擇正確的電平轉(zhuǎn)換解決方案 (Rev. A) 英語版 (Rev.A) 2006年 3月 23日
應用手冊 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
應用手冊 Quad Flatpack No-Lead Logic Packages (Rev. D) 2004年 2月 16日
應用手冊 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
應用手冊 Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
應用手冊 Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
應用手冊 Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 1997年 6月 1日
應用手冊 使用邏輯器件進行設計 (Rev. C) 1997年 6月 1日
應用手冊 Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 1997年 3月 1日
應用手冊 Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 1996年 12月 1日
應用手冊 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
應用手冊 Live Insertion 1996年 10月 1日
應用手冊 Understanding Advanced Bus-Interface Products Design Guide 1996年 5月 1日
選擇指南 Logic Guide (Rev. AC) PDF | HTML 1994年 6月 1日

設計和開發(fā)

如需其他信息或資源，請點擊以下任一標題進入詳情頁面查看（如有）。

評估板

14-24-LOGIC-EVM — 采用 14 引腳至 24 引腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產(chǎn)品通用評估模塊

14-24-LOGIC-EVM 評估模塊 (EVM) 設計用于支持采用 14 引腳至 24 引腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯器件。

用戶指南: PDF | HTML
英語版 (Rev.B): PDF | HTML
TI.com 上無現(xiàn)貨
封裝 引腳 CAD 符號、封裝和 3D 模型
PDIP (N) 20 Ultra Librarian
SOIC (DW) 20 Ultra Librarian
SOP (NS) 20 Ultra Librarian
SSOP (DB) 20 Ultra Librarian
TSSOP (PW) 20 Ultra Librarian

訂購和質(zhì)量

包含信息：
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息：
  • 制造廠地點
  • 封裝廠地點

支持和培訓

視頻