主頁 接口 I2C、I3C 和 SPI IC I2C 和 SPI 通用 I/O (GPIO)

LM8335

正在供貨

具有 MIPI RFFE 主機(jī)接口的 通用輸出擴(kuò)展器

產(chǎn)品詳情

Number of I/Os 8 Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Addresses 2 Rating Catalog Frequency (max) (MHz) 26 Operating temperature range (°C) -30 to 85
Number of I/Os 8 Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Addresses 2 Rating Catalog Frequency (max) (MHz) 26 Operating temperature range (°C) -30 to 85
DSBGA (YZR) 16 5.0625 mm2 2.25 x 2.25
  • MIPI RFFE Interface Version 1.10 Compliant
  • Supports Output Expansion
  • Host Interface Address Select Pin:
    • ADR=GND, USID[3:0]=0001
    • ADR=VDD, USID[3:0]=1001
  • Pin-Configurable Initial State: VIO
    • CFG=GND, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Unmasked
    • CFG=VDD, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Masked
  • Three Sources for Chip Reset:
    • VIO Input Pin
    • POR
    • Software-Commanded Reset

Key Specifications

  • 1.8 ± 0.15V MIPI RFFE Operation (VIO)
  • 1.8 ± 0.15V Core Supply (VDD)
  • 1.65 to 3.6V GPO Supply (VDDIO)
  • Low Standby and Active Current
  • On-Chip Power-On Reset (POR)
  • ?30 to +85°C Ambient Temperature Range
  • 16-Bump DSBGA Package
    • 1.965 mm x 1.965 mm x 0.6 mm, 0.5 mm Pitch (Nominal)

All trademarks are the property of their respective owners.

  • MIPI RFFE Interface Version 1.10 Compliant
  • Supports Output Expansion
  • Host Interface Address Select Pin:
    • ADR=GND, USID[3:0]=0001
    • ADR=VDD, USID[3:0]=1001
  • Pin-Configurable Initial State: VIO
    • CFG=GND, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Unmasked
    • CFG=VDD, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Masked
  • Three Sources for Chip Reset:
    • VIO Input Pin
    • POR
    • Software-Commanded Reset

Key Specifications

  • 1.8 ± 0.15V MIPI RFFE Operation (VIO)
  • 1.8 ± 0.15V Core Supply (VDD)
  • 1.65 to 3.6V GPO Supply (VDDIO)
  • Low Standby and Active Current
  • On-Chip Power-On Reset (POR)
  • ?30 to +85°C Ambient Temperature Range
  • 16-Bump DSBGA Package
    • 1.965 mm x 1.965 mm x 0.6 mm, 0.5 mm Pitch (Nominal)

All trademarks are the property of their respective owners.

The LM8335 General Purpose Output Expander is a dedicated device to provide flexible and general purpose, host programmable output expansion functions. This device communicates with a host processor through a MIPI® RFFE Interface (Mobile Industry Processor Interface RF Front-End).

Eight general purpose outputs (GPO) can be configured by the host controller as drive high/low/high-z. Weak pull-ups (PU) or weak pull-downs (PD) can be enabled.

Upon power-on, the LM8335 default configuration is for all GPO to be set based on the state of the CFG pin.

After startup, any changes to the default configuration must be sent from the host via the MIPI RFFE host interface..

The LM8335 is available in a 16-bump lead-free DSBGA package of size 1.965 mm x 1.965 mm x 0.6 mm (0.5 mm pitch).

The LM8335 General Purpose Output Expander is a dedicated device to provide flexible and general purpose, host programmable output expansion functions. This device communicates with a host processor through a MIPI® RFFE Interface (Mobile Industry Processor Interface RF Front-End).

Eight general purpose outputs (GPO) can be configured by the host controller as drive high/low/high-z. Weak pull-ups (PU) or weak pull-downs (PD) can be enabled.

Upon power-on, the LM8335 default configuration is for all GPO to be set based on the state of the CFG pin.

After startup, any changes to the default configuration must be sent from the host via the MIPI RFFE host interface..

The LM8335 is available in a 16-bump lead-free DSBGA package of size 1.965 mm x 1.965 mm x 0.6 mm (0.5 mm pitch).
下載

技術(shù)文檔

star =有關(guān)此產(chǎn)品的 TI 精選熱門文檔
未找到結(jié)果。請清除搜索并重試。
查看全部 1
類型 標(biāo)題 下載最新的英語版本 日期
* 數(shù)據(jù)表 LM8335 General-Purpose Output Expander with MIPI RFFE Host Interface 數(shù)據(jù)表 (Rev. B) 2013年 5月 2日

訂購和質(zhì)量

包含信息：
  • RoHS
  • REACH
  • 器件標(biāo)識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時(shí)基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息：
  • 制造廠地點(diǎn)
  • 封裝廠地點(diǎn)

支持和培訓(xùn)