SLVUDK6 October   2025 TRF3302-Q1

1.   1
2.   Description
3.   Features
4.   4
5. 1Evaluation Module Overview
   1. 1.1 Introduction
   2. 1.2 Kit Contents
   3. 1.3 Specification
   4. 1.4 Device Information
6. 2Hardware
7. 3Hardware Design Files
   1. 3.1 Schematics
   2. 3.2 PCB Layouts
      1. 3.2.1 PCB Stack-Up and Material
   3. 3.3 Bill of Materials (BOM)
8. 4Additional Information
   1.     Trademarks