SBOK083A August 2024 – October 2024 TMUX582F-SEP
The TMUX582F-SEP is a packaged 20-pin, TSSOP plastic package shown in the pinout diagram in Figure 3-1. Figure 3-2 shows the device with the package decapped to reveal the die for heavy ion testing. Figure 3-3 shows the evaluation board used for radiation testing. Figure 3-4 shows the bias diagrams used for Single-Event Latch-up (SEL) testing.
Figure 3-1 TMUX582F-SEP Pinout Diagram
Figure 3-2 Photo of TMUX582F-SEP Package Decapped
Figure 3-3 TMUX582F-SEP Evaluation Board Top View
Figure 3-4 TMUX582F-SEP SEL Bias #1 Diagram
Figure 3-5 TMUX582F-SEP SEL Bias #2 Diagram
Figure 3-6 TMUX582F-SEP SEL Bias #3 Diagram
Figure 3-7 TMUX582F-SEP Thermal Image for SELPin Name | Condition | Pin Name | Condition |
|---|---|---|---|
A0 | Sq Wv (0V to 3.3V pk-pk, 100kHz freq) | A1 | GND (0V) |
EN | 3V | A2 | GND (0V) |
VSS | GND (0V) | GND | GND (0V) |
S1 | 3V | VDD | 12V |
S2 | GND (0V) | S5 | GND (0V) |
S3 | GND (0V) | S6 | GND (0V) |
S4 | GND (0V) | S7 | GND (0V) |
D | Output (Monitored for SET) | S8 | GND (0V) |
VFN | GND (0V) | VFP | 12V |
SF | 1 kOhm pull-up to 5V | FF | 1 kOhm pull-up to 5V |
| Pin Name | Condition | Pin Name | Condition |
|---|---|---|---|
| A0 | 12V | A1 | 12V |
| EN | 12V | A2 | 12V |
| VSS | GND (0V) | GND | GND (0V) |
| S1 | 12V | VDD | 12V |
| S2 | 12V | S5 | 12V |
| S3 | 12V | S6 | 12V |
| S4 | 12V | S7 | 12V |
| D | Output (Monitored for SET) | S8 | 11 kOhm load to GND (0V) |
| VFN | GND (0V) | VFP | 12V |
| SF | 1 kOhm pull-up to 5V | FF | 1 kOhm pull-up to 5V |
| Pin Name | Condition | Pin Name | Condition |
|---|---|---|---|
| A0 | GND (0V) | A1 | GND (0V) |
| EN | 12V | A2 | GND (0V) |
| VSS | GND (0V) | GND | GND (0V) |
| S1 | 60V [Fault] | VDD | 12V |
| S2 | GND (0V) | S5 | 0GND (0V) |
| S3 | GND (0V) | S6 | GND (0V) |
| S4 | GND (0V) | S7 | GND (0V) |
| D | Output | S8 | GND (0V) |
| VFN | GND (0V) | VFP | 12V |
| SF | 1 kOhm pull-up to 5V (Monitored for SET) | FF | 1 kOhm pull-up to 5V (Monitored for SET) |