SBAK051 March 2025 ADC3664-EP
| Note that qualification by similarity (“qualification family”) per JEDEC JESD47 is allowed. | ||||
|---|---|---|---|---|
| Description | Condition | Sample Size Used and Rejects | Lots Required | Test Method |
| Electromigration | Maximum recommended operating conditions | N/A | N/A | Per TI Design rules |
| Wire bond life | Maximum recommended operating conditions | N/A | N/A | Per TI Design rules |
| Electrical characterization | TI data sheet | 30 | 1 | N/A |
| Electrostatic discharge sensitivity | HBM | 3 units/voltage | 1 | JEDEC JS-001 or EIA/JESD22-A114 |
| CDM | JEDEC JS-002 or EIA/JESD22-C101 | |||
| Latch-up | Per technology | 3/0 | 1 | EIA/JESD78 |
| Thermal impedance | Theta-JA on board | Per pin-package | N/A | EIA/JESD51 |
| Biased HAST | 130°C / 85% / 96 hours | 77/0 | 1 | JESD22-A110/A101* |
| Extended biased HAST | 130°C / 85% / 250 hours (for reference) | 77/0 | 1 | JESD22-A110/A101* |
| Unbiased HAST | 130°C / 85% / 192 hours | 77/0 | 1 | JESD22-A118* |
| Temperature cycle | -65°C to +150°C non-biased for 500 cycles | 77/0 | 1 | JESD22-A104* |
| Solderability | Bake Preconditioning | 22/0 | 1 | ANSI/J-STD-002 |
| Bond pull strength | Per wire size | Two units × 30/0 bonds | 1 | ASTM F-459 |
| High temperature storage | 150°C / 1000 hours | 77/0 | 2 | JESD22-A103* |
| Moisture sensitivity | Surface mount only | 12 | 1 | J-STD-020* |
*Precondition performed per JEDEC Std. 22, Method A112/A113.