SBAK024A February 2025 – March 2025 ADC12QJ1600-SEP
The following is the device qualification summary.
Qualification by Similarity (Qualification Family)
A new device can be qualified either by performing full scale quality and reliability tests on the actual device or using previously qualified devices through Qualification by Similarity (QBS) rules. By establishing similarity between the new device and those qualified previously, repetitive tests will be eliminated, allowing for timely production release. When adopting QBS methodology, the emphasis is on qualifying the differences between a previously qualified product and the new product under consideration. The QBS rules for a technology, product, test parameters or package shall define which attributes are required to remain fixed in order for the QBS rules to apply. The attributes which are expected and allowed to vary will be reviewed and a QBS plan shall be developed, based on the reliability impact assessment above, specifying what subset of the full complement of environmental stresses is required to evaluate the reliability impact of those variations. Each new device shall be reviewed for conformance to the QBS rule sets applicable to that device. See JEDEC JESD47 for more information.
| Note that qualification by similarity (qualification family) per JEDEC JESD47 is allowed. | ||||
|---|---|---|---|---|
| Description | Condition | Sample Size Used and Rejects | Lots Required | Test Method |
| Electromigration | Maximum Recommended Operating Conditions | N/A | N/A | Per TI Design Rules |
| Electrical Characterization | TI Data Sheet | 30 | 1 | N/A |
| Electrostatic Discharge Sensitivity | HBM | 3 units / voltage | 1 | JS-001 |
| CDM | JS-002 | |||
| Latch-up | Per Technology | 3/0 | 1 | EIA/JESD78 |
| Physical Dimensions | TI Data Sheet | 5/0 | 1 | EIA/JESD22- B100 |
| Thermal Impedance | Theta-JC on board | Per Pin-Package | N/A | Modelling |
| Bias Life Test | 125°C / 1000 hours or equivalent | 77/0 | 1 | JESD22-A108* |
| Temperature Humidity Bias | 85°C / 85% / 1000 hours | 77/0 | 1 | JESD22-A110* |
| Extended THB | 85°C / 85% / 2600 hours (for reference) | 77/0 | 1 | JESD22-A110* |
| Unbiased HAST | 110°C / 85% / 528 hours | 77/0 | 1 | JESD22-A.118* |
| Temperature Cycle | -55°C to +125°C non-biased for 1000 cycles | 77/0 | 1 | JESD22-A104* |
| High Temperature Storage Life | 150°C, 1000 hours | 77/0 | 1 | JESD22-A103* |
| Solderability | 22 leads, min 3 devices, 245C +5C | 22/0 | 1 | J-STD-002 |
| Flammability | Method A / Method B | 5/0 | 1 | UL 94V0, Method A |
| Radiation Response Characterization | Total Ionization Dose (TID) | Two units / dose level | 1 | MIL-STD-883/Method 1019 |
| Radiation Response Characterization | Single Event Latch-up (SEL) | 3 | 1 | MIL-STD-883/Method 1019 |
| RLAT | Radiation Lot Acceptance Testing | 5/0 | MIL-STD-883/Method 1019 | |
| Outgassing Characterization, packaged unit | TML (Total Mass Lost)<=1%, CVCM (Collected Volatile Condensable material) <= 0.1% | 5/0 | 1 | ASTM E595 |
| *Precondition performed per JEDEC Std. 22, Method A112/A113. | ||||