ZHCSV99C February 1997 – October 2024 XTR105
PRODUCTION DATA
| THERMAL METRICS(1) | XTR105 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | N (PDIP) | |||
| 14 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 87.3 | 54.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 47.3 | 31.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 46.6 | 25.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 9.9 | 9.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 46.1 | 25.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |