ZHCSK45C august 2019 – december 2020 UCC28740-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | UCC28740-Q1 | UNIT | |
|---|---|---|---|
| D (SOIC) | |||
| 7 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 141.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 73.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 89 | °C/W |
| ψJT | Junction-to-top characterization parameter | 23.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 88.2 | °C/W |