ZHCSIL2C July 2018 – March 2022 UCC24624
PRODUCTION DATA
| THERMAL METRIC(1) | DEVICE | UNIT | |
|---|---|---|---|
| D (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 108.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 43.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 53.6 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 4.9 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 52.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |