ZHCSO02C July 2007 – December 2024 TRSF3221E
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 ESD Ratings, IEC Specifications
- 5.4 Recommended Operating Conditions
- 5.5 Thermal Resistance Characteristics
- 5.6 Electrical Characteristics
- 5.7 Electrical Characteristics, Driver
- 5.8 Switching Characteristics, Driver
- 5.9 Electrical Characteristics, Receiver
- 5.10 Switching Characteristics, Receiver
- 5.11 Electrical Characteristics, Auto-Powerdown
- 5.12 Switching Characteristics, Auto-Powerdown
- 5.13 Typical Characteristics
- 6 Parameter Measurement Information
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- RGT|16
訂購信息
5.13 Typical Characteristics
Figure 5-1 Driver
Pulse Skew vs Load Capacitance and Supply Voltage at TA = 25°C
(RGT Package)
Figure 5-3 . Receiver Path
High-to-Low Propagation Delay vs TA and Supply Voltage (RGT Package)
Figure 5-2 Receiver Path Low-to-High
Propagation Delay vs TA and Supply Voltage (RGT Package)
Figure 5-4 Receiver Pulse Skew
(|tpLH - tpHL|) vs TA and Supply
Voltage (RGT Package)