ZHCSMI2B november 2022 – august 2023 TRF0206-SP
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- FFM|12
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
5 Pin Configuration and Functions
Figure 5-1 FFM Package, 12-Pin LCCC (Top
View)Table 5-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| GND | 1, 4, 7, 10 |
GND |
Ground |
| INM | 5 | I | Differential signal input, negative |
| INP | 6 | I | Differential signal input, positive |
| OUTM | 12 | O | Differential signal output, negative |
| OUTP | 11 | O | Differential signal output, positive |
| PD |
2 |
I | Power down signal. Supports 1.8?V and 3.3?V Logic. 0 = chip enabled 1 = power down |
| TP1 | 8 | — | Test pin. Short to ground. |
| TP2 | 3 | — | Test pin. Short to ground. |
| VDD | 9 | P | 3.3-V supply |
| Thermal Pad | pad | — | Thermal pad. Connect to ground on board. |
(1) I = input, O = output, P = power, GND = Ground