ZHCSOH8F July 2021 – August 2024 TPS7H5001-SP , TPS7H5002-SP , TPS7H5003-SP , TPS7H5004-SP
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Device Comparison Table
- 5 Device Options
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Electrical Characteristics: All Devices
- 7.6 Electrical Characteristics: TPS7H5001-SP
- 7.7 Electrical Characteristics: TPS7H5002-SP
- 7.8 Electrical Characteristics: TPS7H5003-SP
- 7.9 Electrical Characteristics: TPS7H5004-SP
- 7.10 Typical Characteristics
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 VIN and VLDO
- 8.3.2 Start-Up
- 8.3.3 Enable and Undervoltage Lockout (UVLO)
- 8.3.4 Voltage Reference
- 8.3.5 Error Amplifier
- 8.3.6 Output Voltage Programming
- 8.3.7 Soft Start (SS)
- 8.3.8 Switching Frequency and External Synchronization
- 8.3.9 Primary Switching Outputs (OUTA/OUTB)
- 8.3.10 Synchronous Rectifier Outputs (SRA and SRB)
- 8.3.11 Dead Time and Leading Edge Blank Time Programmability (PS, SP, and LEB)
- 8.3.12 Pulse Skipping
- 8.3.13 Duty Cycle Programmability
- 8.3.14 Current Sense and PWM Generation (CS_ILIM)
- 8.3.15 Hiccup Mode Operation (HICC)
- 8.3.16 External Fault Protection (FAULT)
- 8.3.17 Slope Compensation (RSC)
- 8.3.18 Frequency Compensation
- 8.3.19 Thermal Shutdown
- 8.4 Device Functional Modes
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Switching Frequency
- 9.2.2.2 Output Voltage Programming Resistors
- 9.2.2.3 Dead Time
- 9.2.2.4 Leading Edge Blank Time
- 9.2.2.5 Soft-Start Capacitor
- 9.2.2.6 Transformer
- 9.2.2.7 Main Switching FETs
- 9.2.2.8 Synchronous Rectificier FETs
- 9.2.2.9 RCD Clamp
- 9.2.2.10 Output Inductor
- 9.2.2.11 Output Capacitance and Filter
- 9.2.2.12 Sense Resistor
- 9.2.2.13 Hiccup Capacitor
- 9.2.2.14 Frequency Compensation Components
- 9.2.2.15 Slope Compensation Resistor
- 9.2.3 Application Curves
- 9.3 Power Supply Recommendations
- 9.4 Layout
- 10Device and Documentation Support
- 11Revision History
- 12Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- HFT|22
- KGD|0
- PW|24
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
10.5 靜電放電警告
 |
靜電放電 (ESD) 會(huì)損壞這個(gè)集成電路。德州儀器 (TI) 建議通過(guò)適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會(huì)損壞集成電路。 |
| ESD 的損壞小至導(dǎo)致微小的性能降級(jí)，大至整個(gè)器件故障。精密的集成電路可能更容易受到損壞，這是因?yàn)榉浅＜?xì)微的參數(shù)更改都可能會(huì)導(dǎo)致器件與其發(fā)布的規(guī)格不相符。 |