ZHCSSO5A July 2023 – October 2023 TPS7H2140-SEP
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3 Feature Description
- 8.4 Device Functional Modes
- 9 Application and Implementation
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PWP|28
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PWP|28
訂購信息
5 Pin Configuration and Functions
Figure 5-1 PWP Package28-Pin HTSSOP With Exposed Thermal Pad
(Top View)
Table 5-1 Pin Functions
| PIN | I/O(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| CL | 11 | O | Adjustable current limit. Connect to device GND if external current limit is not used. |
| CS | 10 | O | Current-sense output. |
| DIAG_EN | 14 | I | Enable-disable pin for diagnostics; internal pulldown. |
| FAULT | 9 | O | Global fault report with open-drain structure, ORed logic for quad-channel fault conditions. |
| GND | 1, 12 | — | Ground pin. |
| EN1 | 3 | I | Input control for channel 1 activation; internal pulldown. |
| EN2 | 4 | I | Input control for channel 2 activation; internal pulldown. |
| EN3 | 5 | I | Input control for channel 3 activation; internal pulldown. |
| EN4 | 6 | I | Input control for channel 4 activation; internal pulldown. |
| NC | 2, 19, 24 | — | No connect. This pin is not internally connected. It is recommended to connect this pin to GND to prevent charge buildup; however, this pin can also be left open or tied to any voltage between GND and IN. |
| SEH | 7 | I | CS channel-selection high bit; internal pulldown. |
| SEL | 8 | I | CS channel-selection low bit; internal pulldown. |
| THER | 13 | I | Thermal shutdown behavior control, latch off or auto-retry; internal pulldown. |
| OUT1 | 27, 28 | O | Output of the channel 1 high side-switch, connected to the load. |
| OUT2 | 25, 26 | O | Output of the channel 2 high side-switch, connected to the load. |
| OUT3 | 17, 18 | O | Output of the channel 3 high side-switch, connected to the load. |
| OUT4 | 15, 16 | O | Output of the channel 4 high side-switch, connected to the load. |
| IN | 20, 21, 22, 23 | I | Power supply. |
| Thermal pad | — | — | Connect to device GND or leave floating. |
(1) I = Input, O = Other, — = Other