ZHCS516B December 2011 – November 2018 TPS7A4101
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DGN|8
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DGN|8
訂購(gòu)信息
5 Pin Configuration and Functions
DGN Package
8-Pin HVSSOP
Top View
Pin Functions
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| OUT | 1 | O | Regulator output. A capacitor greater than 4.7 µF must be tied from this pin to ground to assure stability. |
| FB | 2 | I | This pin is the input to the control-loop error amplifier. This pin is used to set the output voltage of the device. |
| NC | 3, 6, 7 | — | Not internally connected. This pin must either be left open or tied to GND. |
| GND | 4 | — | Ground |
| EN | 5 | I | This pin turns the regulator on or off.
If VEN ≥ VEN_HI the regulator is enabled. If VEN ≤ VEN_LO, the regulator is disabled. If not used, the EN pin can be connected to IN. Make sure that VEN ≤ VIN at all times. |
| IN | 8 | I | Input supply |
| PowerPAD | — | — | Solder to printed-circuit-board (PCB) to enhance thermal performance.
The PowerPAD is internally connected to GND. Although the PowerPAD can be left floating, TI highly recommends connecting the PowerPAD to the GND plane. |