ZHCSLY5A August 2020 – July 2021 TPS65994AD
PRODUCTION DATA
| THERMAL METRIC | DEVICE | UNIT | |
|---|---|---|---|
| QFN (RSL) | |||
| 48 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 26.8 | °C/W |
| RθJC (top) | Junction-to-case (top) thermal resistance | 15.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 8.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 8.5 | °C/W |
| RθJC (bottom) | Junction-to-case (bottom GND pad) thermal resistance | 1.8 | °C/W |