ZHCSGJ3D July   2015  – February 2019 TPS65917-Q1

PRODUCTION DATA.  

1. 1器件概述
   1. 1.1 特性
   2. 1.2 應(yīng)用
   3. 1.3 說(shuō)明
   4. 1.4 功能圖
2. 2修訂歷史記錄
3. 3Pin Configuration and Functions
   1. 3.1 Pin Attributes
      1.      Pin Attributes
   2. 3.2 Signal Descriptions
4. 4Specifications
   1. 4.1  Absolute Maximum Ratings
   2. 4.2  ESD Ratings
   3. 4.3  Recommended Operating Conditions
   4. 4.4  Thermal Information
   5. 4.5  Electrical Characteristics — LDO Regulators
   6. 4.6  Electrical Characteristics — SMPS1&2 in Dual-Phase Configuration
   7. 4.7  Electrical Characteristics — SMPS1, SMPS2, SMPS3, SMPS4, and SMPS5 Stand-Alone Regulators
   8. 4.8  Electrical Characteristics — Reference Generator (Bandgap)
   9. 4.9  Electrical Characteristics — 32-kHz RC Oscillators and SYNCCLKOUT Output Buffers
   10. 4.10 Electrical Characteristics — 12-Bit Sigma-Delta ADC
   11. 4.11 Electrical Characteristics — Thermal Monitoring and Shutdown
   12. 4.12 Electrical Characteristics — System Control Thresholds
   13. 4.13 Electrical Characteristics — Current Consumption
   14. 4.14 Electrical Characteristics — Digital Input Signal Parameters
   15. 4.15 Electrical Characteristics — Digital Output Signal Parameters
   16. 4.16 I/O Pullup and Pulldown Characteristics
   17. 4.17 Electrical Characteristics — I2C Interface
   18. 4.18 Timing Requirements — I2C Interface
   19. 4.19 Timing Requirements — SPI
   20. 4.20 Switching Characteristics — LDO Regulators
   21. 4.21 Switching Characteristics — SMPS1&2 in Dual-Phase Configuration
   22. 4.22 Switching Characteristics — SMPS1, SMPS2, SMPS3, SMPS4, and SMPS5 Stand-Alone Regulators
   23. 4.23 Switching Characteristics — Reference Generator (Bandgap)
   24. 4.24 Switching Characteristics — PLL for SMPS Clock Generation
   25. 4.25 Switching Characteristics — 32-kHz RC Oscillators and SYNCCLKOUT Output Buffers
   26. 4.26 Switching Characteristics — 12-Bit Sigma-Delta ADC
   27. 4.27 Typical Characteristics
5. 5Detailed Description
   1. 5.1  Overview
   2. 5.2  Functional Block Diagram
   3. 5.3  Device State Machine
      1. 5.3.1  Embedded Power Controller
      2. 5.3.2  State Transition Requests
         1. 5.3.2.1 ON Requests
         2. 5.3.2.2 OFF Requests
         3. 5.3.2.3 SLEEP and WAKE Requests
      3. 5.3.3  Power Sequences
      4. 5.3.4  Device Power Up Timing
      5. 5.3.5  Power-On Acknowledge
         1. 5.3.5.1 POWERHOLD Mode
         2. 5.3.5.2 AUTODEVON Mode
      6. 5.3.6  BOOT Configuration
         1. 5.3.6.1 Boot Pin Usage and Connection
      7. 5.3.7  Reset Levels
      8. 5.3.8  INT
      9. 5.3.9  Warm Reset
      10. 5.3.10 RESET_IN
   4. 5.4  Power Resources (Step-Down and Step-Up SMPS Regulators, LDOs)
      1. 5.4.1 Step-Down Regulators
         1. 5.4.1.1 Output Voltage and Mode Selection
         2. 5.4.1.2 Clock Generation for SMPS
         3. 5.4.1.3 Current Monitoring and Short Circuit Detection
         4. 5.4.1.4 POWERGOOD
         5. 5.4.1.5 DVS-Capable Regulators
            1. 5.4.1.5.1 Non DVS-Capable Regulators
         6. 5.4.1.6 Step-Down Converters SMPS1, SMPS2 or SMPS1&2
         7. 5.4.1.7 Step-Down Converters SMPS3, SMPS4, and SMPS5
      2. 5.4.2 Low Dropout Regulators (LDOs)
         1. 5.4.2.1 LDOVANA
         2. 5.4.2.2 LDOVRTC
         3. 5.4.2.3 LDO1 and LDO2
         4. 5.4.2.4 Low-Noise LDO (LDO5)
         5. 5.4.2.5 Other LDOs
   5. 5.5  SMPS and LDO Input Supply Connections
   6. 5.6  First Supply Detection
   7. 5.7  Long-Press Key Detection
   8. 5.8  12-Bit Sigma-Delta General-Purpose ADC (GPADC)
      1. 5.8.1 Asynchronous Conversion Request (SW)
      2. 5.8.2 Periodic Conversion (AUTO)
      3. 5.8.3 Calibration
   9. 5.9  General-Purpose I/Os (GPIO Pins)
   10. 5.10 Thermal Monitoring
       1. 5.10.1 Hot-Die Function (HD)
       2. 5.10.2 Thermal Shutdown
   11. 5.11 Interrupts
   12. 5.12 Control Interfaces
       1. 5.12.1 I2C Interfaces
          1. 5.12.1.1 I2C Implementation
          2. 5.12.1.2 F/S Mode Protocol
          3. 5.12.1.3 HS Mode Protocol
       2. 5.12.2 Serial Peripheral Interface (SPI)
          1. 5.12.2.1 SPI Modes
          2. 5.12.2.2 SPI Protocol
   13. 5.13 OTP Configuration Memory
   14. 5.14 Watchdog Timer (WDT)
   15. 5.15 System Voltage Monitoring
   16. 5.16 Register Map
       1. 5.16.1 Functional Register Mapping
   17. 5.17 Device Identification
6. 6Applications, Implementation, and Layout
   1. 6.1 Application Information
   2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
         1. 6.2.2.1 SMPS Input Capacitors
         2. 6.2.2.2 SMPS Output Capacitors
         3. 6.2.2.3 SMPS Inductors
         4. 6.2.2.4 LDO Input Capacitors
         5. 6.2.2.5 LDO Output Capacitors
         6. 6.2.2.6 VCCA
            1. 6.2.2.6.1 Meeting the Power-Down Sequence
            2. 6.2.2.6.2 Maintaining Sufficient Input Voltage
         7. 6.2.2.7 VIO_IN
         8. 6.2.2.8 GPADC
      3. 6.2.3 Application Curves
   3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
      2. 6.3.2 Layout Example
   4. 6.4 Power Supply Coupling and Bulk Capacitors
7. 7器件和文檔支持
   1. 7.1 器件支持
      1. 7.1.1 第三方產(chǎn)品免責(zé)聲明
      2. 7.1.2 器件命名規(guī)則
   2. 7.2 文檔支持
      1. 7.2.1 相關(guān)文檔
   3. 7.3 接收文檔更新通知
   4. 7.4 社區(qū)資源
   5. 7.5 商標(biāo)
   6. 7.6 靜電放電警告
   7. 7.7 Glossary
8. 8機(jī)械、封裝和可訂購(gòu)信息