ZHCSJL9B April 2019 – April 2019 TPS566235
PRODUCTION DATA.
| THERMAL METRIC(1) | TPS566235 | UNIT | |
|---|---|---|---|
| RJN (VQFN) | |||
| 13 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 70 | °C/W |
| RθJA_effective | Junction-to-ambient thermal resistance with TI EVM | 34.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 46.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 22.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 22.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |