7.4 Thermal Information
| THERMAL METRIC (1) |
DBV (6 PINS) |
UNIT |
| RθJA(2) |
Junction-to-ambient thermal resistance |
173 |
°C/W |
| RθJC_T |
Junction-to-case (TOP) thermal resistance |
116 |
°C/W |
| RθJC_B |
Junction-to-case (BOTTOM) thermal resistance |
31 |
°C/W |
| ψJT |
Junction-to-top characterization parameter |
20 |
°C/W |
| ψJB |
Junction-to-board characterization parameter |
30 |
°C/W |
(1) For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics application report,
SPRA953
(2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were calculated in accordance with JESD 51-7, and simulated on a specified JEDEC board. They do not represent the performance obtained in an actual application.