ZHCSQP7 august 2023 TPS51385
PRODUCTION DATA
| THERMAL METRIC(1) | DEVICE | UNIT | ||
|---|---|---|---|---|
| RJNR (QFN, JEDEC) | RJNR (QFN, TI EVM) | |||
| 12 PINS | 12 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 72.7 | 37.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 50.1 | Not Applicable (2) | °C/W |
| RθJB | Junction-to-board thermal resistance | 18.7 | Not Applicable (2) | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.8 | 3.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 18.4 | 18.5 | °C/W |