ZHCSMM0 December   2020 TPS27SA08-Q1

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 Revision History
5. 5 Device Summary Table
6. 6 Pin Configuration and Functions
   1. 6.1 Recommended Connections for Unused Pins
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 Switching Characteristics
   7. 7.7 SNS Timing Characteristics
   8. 7.8 Typical Characteristics
8. 8 Parameter Measurement Information
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Protection Mechanisms
         1. 9.3.1.1 Thermal Shutdown
         2. 9.3.1.2 Current Limit
            1. 9.3.1.2.1 Current Limit Foldback
            2. 9.3.1.2.2 Undervoltage Lockout (UVLO)
            3. 9.3.1.2.3 VBB during Short-to-Ground
         3. 9.3.1.3 Energy Limit
         4. 9.3.1.4 Voltage Transients
            1. 9.3.1.4.1 Driving Inductive and Capacitive Loads
         5. 9.3.1.5 Reverse supply
         6. 9.3.1.6 Fault Event – Timing Diagrams
      2. 9.3.2 Diagnostic Mechanisms
         1. 9.3.2.1 VOUT Short-to-supply and Open-Load
            1. 9.3.2.1.1 Detection With Switch Enabled
            2. 9.3.2.1.2 Detection With Switch Disabled
         2. 9.3.2.2 SNS Output
            1. 9.3.2.2.1 RSNS Value
               1. 9.3.2.2.1.1 High Accuracy Load Current Sense
               2. 9.3.2.2.1.2 SNS Output Filter
         3. 9.3.2.3 ST Pin
         4. 9.3.2.4 Fault Indication and SNS Mux
         5. 9.3.2.5 Resistor Sharing
         6. 9.3.2.6 High-Frequency, Low Duty-Cycle Current Sensing
   4. 9.4 Device Functional Modes
      1. 9.4.1 Off
      2. 9.4.2 Standby
      3. 9.4.3 Diagnostic
      4. 9.4.4 Standby Delay
      5. 9.4.5 Active
      6. 9.4.6 Fault
10. 10Application and Implementation
    1. 10.1 Application Information
       1. 10.1.1 Ground Protection Network
       2. 10.1.2 Interface With Microcontroller
       3. 10.1.3 I/O Protection
       4. 10.1.4 Inverse Current
       5. 10.1.5 Loss of GND
       6. 10.1.6 Thermal Information
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
          1. 10.2.2.1 Thermal Considerations
          2. 10.2.2.2 Diagnostics
             1. 10.2.2.2.1 Selecting the RISNS Value
       3. 10.2.3 Application Curves
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
13. 13Device and Documentation Support
    1. 13.1 Device Support
       1. 13.1.1 Related Documentation
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
14. 14Mechanical, Packaging, and Orderable Information