ZHCSHL4I October 2008 – December 2017 TPS23754 , TPS23754-1 , TPS23756
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3 Feature Description
- 7.4
Device Functional Modes
- 7.4.1
PoE Overview
- 7.4.1.1 Threshold Voltages
- 7.4.1.2 PoE Start-Up Sequence
- 7.4.1.3 Detection
- 7.4.1.4 Hardware Classification
- 7.4.1.5 Inrush and Start-Up
- 7.4.1.6 Maintain Power Signature
- 7.4.1.7 Start-Up and Converter Operation
- 7.4.1.8 PD Hotswap Operation
- 7.4.1.9 Converter Controller Features
- 7.4.1.10 Bootstrap Topology
- 7.4.1.11 Current Slope Compensation and Current Limit
- 7.4.1.12 Blanking – RBLNK
- 7.4.1.13 Dead Time
- 7.4.1.14 FRS and Synchronization
- 7.4.1.15 T2P, Start-Up, and Power Management
- 7.4.1.16 Thermal Shutdown
- 7.4.1.17 Adapter ORing
- 7.4.1.18 PPD ORing Features
- 7.4.1.19 Using DEN to Disable PoE
- 7.4.1.20 ORing Challenges
- 7.4.1
PoE Overview
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 Input Bridges and Schottky Diodes
- 8.2.2.2 Protection, D1
- 8.2.2.3 Capacitor, C1
- 8.2.2.4 Detection Resistor, RDEN
- 8.2.2.5 Classification Resistor, RCLS
- 8.2.2.6 Dead Time Resistor, RDT
- 8.2.2.7 Switching Transformer Considerations and RVC
- 8.2.2.8 Special Switching MOSFET Considerations
- 8.2.2.9 Thermal Considerations and OTSD
- 8.2.2.10 APD Pin Divider Network, RAPD1, RAPD2
- 8.2.2.11 PPD Pin Divider Network, RPPD1, RPPD2
- 8.2.2.12 Setting Frequency (RFRS) and Synchronization
- 8.2.2.13 Current Slope Compensation
- 8.2.2.14 Blanking Period, RBLNK
- 8.2.2.15 Estimating Bias Supply Requirements and CVC
- 8.2.2.16 T2P Pin Interface
- 8.2.2.17 Advanced ORing Techniques
- 8.2.2.18 Soft Start
- 8.2.2.19 Frequency Dithering for Conducted Emissions Control
- 8.2.3 Application Curves
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PWP|20
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PWP|20
訂購信息
7.4.1.17 Adapter ORing
Many PoE-capable devices are designed to operate from either a wall adapter or PoE power. A local power solution adds cost and complexity, but allows a product to be used if PoE is not available in a particular installation. While most applications only require that the PD operate when both sources are present, the TPS23754 device supports forced operation from either of the power sources. Figure 26 illustrates three options for diode ORing external power into a PD. Only one option would be used in any particular design. Option 1 applies power to the TPS23754 device PoE input, option 2 applies power between the TPS23754 device PoE section and the power circuit, and option 3 applies power to the output side of the converter. Each of these options has advantages and disadvantages. Many of the basic ORing configurations and discussion contained in application note, Advanced Adapter ORing Solutions using the TPS23753 (SLVA306), apply to the TPS23754 device.
Figure 26. ORing Configurations
The IEEE standards require that the Ethernet cable be isolated from ground and all other system potentials. The adapter must meet a minimum 1500 Vac dielectric withstand test between the output and all other connections for ORing options 1 and 2. The adapter only needs this isolation for option 3 if it is not provided by the converter.
Adapter ORing diodes are shown for all the options to protect against a reverse voltage adapter, a short on the adapter input pins, and damage to a low-voltage adapter. ORing is sometimes accomplished with a MOSFET in option 3.