ZHCSAP5E December 2012 – October 2024 TPD4E1B06
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
4 Pin Configuration and Functions
Figure 4-1 DCK Package, 6-Pin SC70 (Top View)
Figure 4-2 DRL Package, 6-Pin SOT (Top View)Table 4-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | NO. | |||
| DCK | DRL | |||
| IO1 | 1 | 1 | I/O | ESD protected channel. Connect to data line as close to the connector as possible. |
| IO2 | 2 | 3 | I/O | ESD protected channel. Connect to data line as close to the connector as possible. |
| IO3 | 4 | 4 | I/O | ESD protected channel. Connect to data line as close to the connector as possible. |
| IO4 | 5 | 6 | I/O | ESD protected channel. Connect to data line as close to the connector as possible. |
| GND | 3 | 2 | GND | Ground |
| NC | 6 | 5 | NC | Not internally connected |
(1) I = input, O = output, GND = ground, NC = no connection