ZHCSFI9B August 2016 – September 2023 TPD1E10B09-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TPD1E10B09-Q1 | UNIT | |
|---|---|---|---|
| DPY (X1SON) | |||
| 2 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 615.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 404.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 493.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 127.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 493.3 | °C/W |