ZHCSKV6C March 2020 – May 2024 TPA6211T-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TPA6211T-Q1 | UNIT | |
|---|---|---|---|
| DGN (HVSSOP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 53.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 72.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 26.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 26.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 10.2 | °C/W |