ZHCSF33A December   2015  – February 2016 TPA3250

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說明
4. 4 修訂歷史記錄
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Electrical Characteristics
   6. 7.6  Audio Characteristics (BTL)
   7. 7.7  Audio Characteristics (SE)
   8. 7.8  Audio Characteristics (PBTL)
   9. 7.9  Typical Characteristics, BTL Configuration
   10. 7.10 Typical Characteristics, SE Configuration
   11. 7.11 Typical Characteristics, PBTL Configuration
8. 8 Parameter Measurement Information
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagrams
   3. 9.3 Feature Description
      1. 9.3.1 Error Reporting
   4. 9.4 Device Functional Modes
      1. 9.4.1 Device Protection System
         1. 9.4.1.1 Overload and Short Circuit Current Protection
         2. 9.4.1.2 DC Speaker Protection
         3. 9.4.1.3 Pin-to-Pin Short Circuit Protection (PPSC)
         4. 9.4.1.4 Overtemperature Protection OTW and OTE
         5. 9.4.1.5 Undervoltage Protection (UVP) and Power-on Reset (POR)
         6. 9.4.1.6 Fault Handling
         7. 9.4.1.7 Device Reset
10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
       1. 10.2.1 Stereo BTL Application
          1. 10.2.1.1 Design Requirements
          2. 10.2.1.2 Detailed Design Procedures
             1. 10.2.1.2.1 Decoupling Capacitor Recommendations
             2. 10.2.1.2.2 PVDD Capacitor Recommendation
             3. 10.2.1.2.3 PCB Material Recommendation
             4. 10.2.1.2.4 Oscillator
       2. 10.2.2 Application Curves
       3. 10.2.3 Typical Application, Single Ended (1N) SE
          1. 10.2.3.1 Design Requirements
          2. 10.2.3.2 Detailed Design Procedures
          3. 10.2.3.3 Application Curves
       4. 10.2.4 Typical Application, Differential (2N) PBTL
          1. 10.2.4.1 Design Requirements
          2. 10.2.4.2 Detailed Design Procedures
          3. 10.2.4.3 Application Curves
11. 11Power Supply Recommendations
    1. 11.1 Power Supplies
       1. 11.1.1 VDD Supply
       2. 11.1.2 GVDD_X Supply
       3. 11.1.3 PVDD Supply
    2. 11.2 Powering Up
    3. 11.3 Powering Down
    4. 11.4 Thermal Design
       1. 11.4.1 Thermal Performance
       2. 11.4.2 Thermal Performance with Continuous Output Power
       3. 11.4.3 Thermal Performance with Non-Continuous Output Power
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
       1. 12.2.1 BTL Application Printed Circuit Board Layout Example
       2. 12.2.2 SE Application Printed Circuit Board Layout Example
       3. 12.2.3 PBTL Application Printed Circuit Board Layout Example
13. 13器件和文檔支持
    1. 13.1 文檔支持
    2. 13.2 社區(qū)資源
    3. 13.3 商標(biāo)
    4. 13.4 靜電放電警告
    5. 13.5 Glossary
14. 14機(jī)械、封裝和可訂購信息