ZHCSP22B october 2021 – march 2023 TMUX8211 , TMUX8212 , TMUX8213
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings: TMUX821x Devices
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions: TMUX821x Devices
- 7.4 漏極持續(xù)電流源
- 7.5 漏極脈沖電流源
- 7.6 Thermal Information
- 7.7 Electrical Characteristics (Global): TMUX821x Devices
- 7.8 Electrical Characteristics (±15-V Dual Supply)
- 7.9 Electrical Characteristics (±36-V Dual Supply)
- 7.10 Electrical Characteristics (±50-V Dual Supply)
- 7.11 Electrical Characteristics (72-V Single Supply)
- 7.12 Electrical Characteristics (100-V Single Supply)
- 7.13 Switching Characteristics: TMUX821x Devices
- 7.14 Typical Characteristics
- 8 Parameter Measurement Information
- 9 Detailed Description
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
- RUM|16
訂購信息
6 Pin Configuration and Functions
Figure 6-1 PW Package, 16-Pin TSSOP (Top View)
Figure 6-2 RUM Package, 16-Pin WQFN (Top View)Table 6-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | TSSOP | WQFN | ||
| D1 | 2 | 16 | I/O | Drain pin 1. Can be an input or output. |
| D2 | 15 | 13 | I/O | Drain pin 2. Can be an input or output. |
| D3 | 10 | 8 | I/O | Drain pin 3. Can be an input or output. |
| D4 | 7 | 5 | I/O | Drain pin 4. Can be an input or output. |
| GND | 5 | 3 | P | Ground (0 V) reference |
| S1 | 1 | 15 | I/O | Source pin 1. Can be an input or output. |
| S2 | 16 | 14 | I/O | Source pin 2. Can be an input or output. |
| S3 | 9 | 7 | I/O | Source pin 3. Can be an input or output. |
| S3 | 9 | 7 | I/O | Source pin 3. Can be an input or output. |
| S4 | 8 | 6 | I/O | Source pin 4. Can be an input or output. |
| SEL1 | 3 | 2 | I | Logic control input 1. |
| SEL2 | 14 | 12 | I | Logic control input 2. |
| SEL3 | 11 | 11 | I | Logic control input 3. |
| SEL4 | 6 | 4 | I | Logic control input 4. |
| N.C. | 12 | 10 | — | No internal connection. |
| VDD | 13 | 9 | P | Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 1 μF to 10 μF between VDD and GND. |
| VSS | 4 | 1 | P | Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 1 μF to 10 μF between VSS and GND. |
| Thermal Pad | — | The thermal pad is not connected internally. It is recommended that the pad be tied to GND or VSS for best performance. | ||
(1) I = input, O = output, I/O = input and output, P = power