ZHCSM60B september 2021 – august 2023 TMUX8108 , TMUX8109
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TMUX8108 | TMUX8109 | TMUX8108 TMUX8109 |
UNIT | |
|---|---|---|---|---|---|
| PW (TSSOP) | PW (TSSOP) | RUM (QFN) | |||
| 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 97.0 | 96.4 | 41.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 26.7 | 26.5 | 25.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 43.8 | 43.1 | 17.0 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 1.1 | 1.1 | 0.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 43.1 | 42.5 | 17.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | 3.2 | °C/W |