ZHCSOX0B March 2023 – May 2024 TMUX6221 , TMUX6222
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TMUX622x | UNIT | |
|---|---|---|---|
| DGS (VSSOP) | |||
| 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 154.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 52.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 75.3 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 5.9 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 73.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |