ZHCSJ03B November 2018 – February 2024 TMUX1108
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics (VDD = 5V ±10 %)
- 6.6 Electrical Characteristics (VDD = 3.3V ±10 %)
- 6.7 Electrical Characteristics (VDD = 2.5V ±10 %), (VSS?= –2.5V ±10 %)
- 6.8 Electrical Characteristics (VDD = 1.8V ±10 %)
- 6.9 Electrical Characteristics (VDD = 1.2V ±10 %)
- 6.10 Typical Characteristics
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- RSV|16
訂購信息
7.3.6 Ultra-low Charge Injection
The TMUX1108 has a transmission gate topology, as shown in Figure 7-13. Any mismatch in the stray capacitance associated with the NMOS and PMOS causes an output level change whenever the switch is opened or closed.
Figure 7-13 Transmission Gate TopologyThe TMUX1108 has special charge-injection cancellation circuitry that reduces the source-to-drain charge injection to as low as 1pC at VS = 1V as shown in Figure 7-14.
Figure 7-14 Charge Injection vs Source or Drain Voltage