ZHCSFP0 November 2016 TMP75C-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機械、封裝和可訂購信息
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Supply voltage, VS | 4 | V | ||
| Input voltage | SDA, SCL, ALERT, A2, A1 | –0.3 | 4 | V |
| A0 | –0.3 | (VS) + 0.3 | V | |
| Sink current | SDA, ALERT | 10 | mA | |
| Operating junction temperature | –40 | 150 | °C | |
| Storage temperature, Tstg | –60 | 150 | °C | |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | ±2000 | V |
| Charged-device model (CDM), per AEC Q100-011 | ±1000 | |||
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| Supply voltage | 1.4 | 1.8 | 3.6 | V | |
| Operating free-air temperature, TA | –40 | 125 | °C | ||
6.4 Thermal Information
| THERMAL METRIC(1) | TMP75C-Q1 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 125.4 | 188.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 71.5 | 79.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 65.8 | 109.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 21.1 | 15.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 65.3 | 108 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
At TA = –40°C to +125°C and VS = +1.4 V to +3.6 V, unless otherwise noted. Typical values at TA = 25°C and VS = +1.8 V.| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| TEMPERATURE INPUT | ||||||
| Temperature range | –40 | 125 | °C | |||
| Temperature resolution | 0.0625 | °C | ||||
| Temperature accuracy (error) | 0°C to +70°C | ±0.25 | ±1 | °C | ||
| –20°C to +85°C | ±0.5 | ±2 | ||||
| –40°C to +125°C | ±1 | ±3 | ||||
| DIGITAL INPUT/OUTPUT | ||||||
| VIH | High-level input voltage | 0.7(VS) | VS | V | ||
| VIL | Low-level input voltage | -0.3 | 0.3(VS) | V | ||
| IIN | Input current | 0 V < VIN < (VS) + 0.3 V | 1 | μA | ||
| VOL | Low-level output voltage | VS ≥ 2 V, IOUT = 3 mA | 0.4 | V | ||
| VS < 2 V, IOUT = 3 mA | 0.2(VS) | |||||
| ADC resolution | 12 | Bit | ||||
| Conversion time | One-shot mode | 20 | 27 | 35 | ms | |
| Update Rate | 80 | ms | ||||
| Bus timeout time | 16 | 22 | 29 | ms | ||
| POWER SUPPLY | ||||||
| Operating supply range | 1.4 | 3.6 | V | |||
| IQ | Quiescent current | Serial bus inactive | 15 | 37 | µA | |
| Serial bus active, SCL frequency = 400 kHz | 25 | |||||
| Serial bus active, SCL frequency = 3.4 MHz | 95 | |||||
| ISD | Shutdown current | Serial bus inactive | 0.3 | 8 | µA | |
| Serial bus active, SCL frequency = 400 kHz | 10 | |||||
| Serial bus active, SCL frequency = 3.4 MHz | 80 | |||||
6.6 Typical Characteristics
At TA = 25°C and VS = +1.8 V (unless otherwise noted).
